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ePub Interconnect Analysis and Synthesis download

by Chung-Kuan Cheng,John Lillis,Shen Lin,Norman Chang

ePub Interconnect Analysis and Synthesis download
Author:
Chung-Kuan Cheng,John Lillis,Shen Lin,Norman Chang
ISBN13:
978-0471293668
ISBN:
0471293660
Language:
Publisher:
Wiley-Interscience; 1 edition (November 3, 1999)
Category:
Subcategory:
Engineering
ePub file:
1317 kb
Fb2 file:
1520 kb
Other formats:
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4.5
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Interconnect Analysis and Synthesis book. Chung-Kuan Cheng, John Lillis. Shen Lin., Norman Chang.

Interconnect Analysis and Synthesis book.

Chung-Kuan Cheng, John Lillis, Shen Lin, Norman Chang. Chung-Kuan Cheng is the author of Interconnect Analysis and Synthesis, published by Wiley. ISBN: 978-0-471-29366-8 November 1999 262 Pages.

Interconnect analysis and synthesis by Chung-Kuan Cheng, John Lillis, Shen Lin, Norman Chang, November 3, 1999 . Are you sure you want to remove Interconnect Analysis and Synthesis from your list?

Are you sure you want to remove Interconnect Analysis and Synthesis from your list? Interconnect Analysis and Synthesis. by Chung-Kuan Cheng, John Lillis, Shen Lin, Norman Chang. Published November 3, 1999 by Wiley-Interscience.

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State-of-the-art methods and current perspectives on interconnectThe irrepressible march toward smaller and faster integratedcircuits has made interconnect a hot topic for semiconductorresearch. The effects of wire size, topology construction, andnetwork design on system performance and reliability have all beenthoroughly investigated in recent years. Interconnect Analysis andSynthesis provides CAD researchers and engineers with powerful,state-of-the-art tools for the analysis, design, and optimizationof interconnect. It brings together a wealth of informationpreviously scattered throughout the literature, explaining in depthavailable analysis techniques and presenting a range of CADalgorithms for synthesizing and optimizing interconnect. Along withexamples and results from the semiconductor industry and 150illustrations, this practical work features:* Models for interconnect as well as devices and the impact ofscaling trends* Modern analysis techniques, from matrix reduction and momentmatching to transmission-line analysis* An overview of the effects of inductance on on-chipinterconnect* Flexible CAD algorithms that can be generalized for differentneeds, from buffer insertion to wire sizing to routingtopology* Emphasis on realistic problem formulations, addressing key designtradeoffs such as those between area and performance